Feurprier, M: search on Z-Library

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1

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, United States (Sunday 22 February 2015)] Advanced Etch Technology for Nanopatterning IV - Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)

Lin, Qinghuang, Engelmann, Sebastian U., Zhang, Ying, Feurprier, Yannick, Lutker-Lee, Katie, Rastogi, Vinayak, Matsumoto, Hiroie, Chiba, Yuki, Metz, Andrew, Kumar, Kaushik, Beique, Genevieve, Labonte,

Year:

2015

Language:

english

File:

PDF, 2.57 MB

english, 2015

2

Mortality risk in the French cohort of uranium miners: extended follow-up 1946–1999

B Vacquier, S Caer, A Rogel, M Feurprier, M Tirmarche, C Luccioni, B Quesne, A Acker and D Laurier

Journal:

Occupational and Environmental Medicine

Year:

2008

Language:

english

File:

PDF, 1.69 MB

english, 2008

3

Reaction kinetics of chlorine on Si(111)7 × 7 surfaces

Jiro Matsuo, Feurprier Yannick, Kazuhiro Karahashi

Journal:

Surface Science Letters

Year:

1993

Language:

english

File:

PDF, 73 KB

english, 1993

4

MOCVD of InGaAsP, InGaAs and InGaP over InP and GaAs substrates: distribution of composition and growth rate in a horizontal reactor

O Féron, M Sugiyama, W Asawamethapant, N Futakuchi, Y Feurprier, Y Nakano, Y Shimogaki

Journal:

Applied Surface Science

Year:

2000

Language:

english

File:

PDF, 2.50 MB

english, 2000

5

Reaction kinetics of chlorine on Si(111)7 × 7 surfaces

Jiro Matsuo, Feurprier Yannick, Kazuhiro Karahashi

Journal:

Surface Science

Year:

1993

Language:

english

File:

PDF, 514 KB

english, 1993

6

Mise en évidence des secteurs d’activité économique à haut risque d’accident du travail : utilisation d’un outil de surveillance construit à partir des données de réparation des régimes de sécurité sociale

Chevalier, A., Brière, J., Feurprier, M., Paboeuf, F., Imbernon, E.

Journal:

Archives des Maladies Professionnelles et de l'Environnement

Year:

2012

Language:

french

File:

PDF, 65 KB

french, 2012

7

High aspect ratio SiO[sub 2] etching with high resist selectivity improved by addition of organosilane to tetrafluoroethyl trifluoromethyl ether

Y. Chinzei, Y. Feurprier, M. Ozawa, T. Kikuchi, K. Horioka, T. Ichiki, Y. Horiike

Year:

2000

Language:

english

File:

PDF, 648 KB

english, 2000

8

Microloading effect in ultrafine SiO[sub 2] hole/trench etching

Y. Feurprier, Y. Chinzei, M. Ogata, T. Kikuchi, M. Ozawa, T. Ichiki, Y. Horiike

Year:

1999

Language:

english

File:

PDF, 574 KB

english, 1999

9

Proposal for an etching mechanism of InP in CH[sub 4]-H[sub 2] mixtures based on plasma diagnostics and surface analysis

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

1998

Language:

english

File:

PDF, 476 KB

english, 1998

10

Mortality risk in the French cohort of uranium miners: extended follow-up 1946-1999

Vacquier, B, Caer, S, Rogel, A, Feurprier, M, Tirmarche, M, Luccioni, C, Quesne, B, Acker, A, Laurier, D

Journal:

Occupational and Environmental Medicine

Year:

2008

Language:

english

File:

PDF, 342 KB

english, 2008

11

Influence of the gas mixture on the reactive ion etching of InP in CH[sub 4]-H[sub 2] plasmas

Journal:

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures

Year:

1997

Language:

english

File:

PDF, 565 KB

english, 1997

12

X-ray photoelectron spectroscopy damage characterization of reactively ion etched InP in CH[sub 4]–H[sub 2] plasmas

Year:

1998

Language:

english

File:

PDF, 567 KB

english, 1998

13

Etch product identification during - RIE of InP using mass spectrometry

Feurprier, Y, Cardinaud, Ch, Grolleau, B, Turban, G

Journal:

Plasma Sources Science and Technology

Year:

1997

Language:

english

File:

PDF, 219 KB

english, 1997

14

Surface modification and etch product detection during reactive ion etching of InP in - plasma

Y. Feurprier, C. Cardinaud, G. Turban

Year:

1997

Language:

english

File:

PDF, 396 KB

english, 1997

15

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, United States (Sunday 21 February 2016)] Advanced Etch Technology for Nanopatterning V - Plasma etch patterning of EUV lithography: balancing roughness and selectivity trade off

Lin, Qinghuang, Engelmann, Sebastian U., Rastogi, Vinayak, Beique, Genevieve, Sun, Lei, Cottle, Hongyun, Feurprier, Yannick, Metz, Andrew W., Kumar, Kaushik A., Labelle, Catherine, Arnold, John, Colbu

Year:

2016

Language:

english

File:

PDF, 2.15 MB

english, 2016

16

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, United States (Sunday 26 February 2017)] Advanced Etch Technology for Nanopatterning VI - Self-aligned block technology: a step toward further scaling

Engelmann, Sebastian U., Wise, Rich S., Lazzarino, Frédéric, Mohanty, Nihar, Feurprier, Yannick, Huli, Lior, Luong, Vinh, Demand, Marc, Decoster, Stefan, Vega Gonzalez, Victor, Ryckaert, Julien, Kim,

Year:

2017

Language:

english

File:

PDF, 5.02 MB

english, 2017

17

Could workplace accidents covered by social insurance workers compensation funds be used to calculate national indicators for surveillance of occupational injuries in France?

Briere, J., Chevalier, A., Feurprier, M., Paboeuf, F., Imbernon, E.

Journal:

Injury Prevention

Year:

2010

Language:

english

File:

PDF, 56 KB

english, 2010

18

Could workers compensation data be used for epidemiological surveillance of occupational injuries in France?

Chevalier, A., Briere, J., Feurprier, M., Paboeuf, F., Imbernon, E.

Journal:

Occupational and Environmental Medicine

Year:

2011

Language:

english

File:

PDF, 62 KB

english, 2011